Integration of electronics into textiles
About the project
About the Technology
When developing e-textile systems, the electrical and mechanical connection of mostly hard components with soft, flexible materials is a major challenge. Standard technologies such as soldering are not suitable for temperature-sensitive textiles, and embroidered contacts offer insufficient protection against short circuits and environmental influences. Fraunhofer IZM specializes in the development of textile-compatible connection solutions and, within the scope of this project, offers access to the latest and more advanced technologies such as non-conductive adhesive bonding, ultrasonic plastic welding, low-temperature soldering or mechanical connectors. This enables the development of samples batches, small series and is also suitable for production.
Usual Areas of Application
Materials Used in Re-FREAM
Technology is used by these Re-FREAM Partners
Fraunhofer IZM (Berlin, Germany)